Multi-functional integrated sensors for the environment

Author

Roozeboom, C.L. ; Sim, J.Y. ; Wickeraad, D. ; Dura, B. ; Smith, W.S. ; Hopcroft, M.A. ; Hartwell, P.G. ; Williams, R.S. ; Pruitt, B.L.

Author_Institution

Stanford Univ., Stanford, CA, USA

fYear

2012

fDate

Jan. 29 2012-Feb. 2 2012

Firstpage

144

Lastpage

147

Abstract

We present multi-functional integrated sensors for the environment (MFISEs) combining ten sensor functions on a single silicon die. The purpose of the MFISEs chip is to monitor important environmental parameters such as temperature, humidity and air speed, along with acceleration in three axes. Through a common fabrication process and integrated sensor design, the ten sensing functions required only five photolithography mask steps. To our knowledge, MFISEs demonstrates the highest degree of sensor fusion on a single die. Sensor integration is a key enabler of new applications in mobile electronics and wireless sensor networks, and the potential to use MFISEs for ten sensing functions provides significant cost, size, and power savings over ten individual devices.

Keywords

environmental factors; masks; photolithography; sensor fusion; wireless sensor networks; MFISE chip; acceleration; air speed; environmental parameters; fabrication process; five photolithography mask steps; humidity; integrated sensor design; mobile electronics; multifunctional integrated sensors; sensor functions; sensor fusion; sensor integration; single silicon die; temperature; ten sensing functions; wireless sensor networks; Fluid flow measurement; Humidity; Magnetic sensors; Resistance; Temperature sensors; Wireless sensor networks;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on

Conference_Location

Paris

ISSN

1084-6999

Print_ISBN

978-1-4673-0324-8

Type

conf

DOI

10.1109/MEMSYS.2012.6170114

Filename

6170114