Title :
Micro/nano hierarchical structure in microchannel heat sink for boiling enhancement
Author :
Yao, Z. ; Lu, Y.-W. ; Kandlikar, S.G.
Author_Institution :
Rochester Inst. of Technol., Rochester, NY, USA
fDate :
Jan. 29 2012-Feb. 2 2012
Abstract :
Uniform SiNW structures were fabricated for the first time on the top, bottom and sidewall surfaces of microchannel heat sinks by using a two-step electro-less etching process. The micro/nano hierarchical structure yields superior boiling heat transfer performance. Its maximum heat flux is improved by 150% over the microchannel-only heat sink and 400% over a plain silicon surface. These results provide a new insight into the boiling mechanism for microchannel heat sinks using hierarchical structures.
Keywords :
boiling; etching; heat sinks; heat transfer; microchannel flow; microfabrication; silicon compounds; SiNW; boiling enhancement; electroless etching process; heat transfer; micro hierarchical structure; microchannel heat sink; nano hierarchical structure; Etching; Heat sinks; Heat transfer; Microchannel; Periodic structures; Silicon;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on
Conference_Location :
Paris
Print_ISBN :
978-1-4673-0324-8
DOI :
10.1109/MEMSYS.2012.6170150
