Title :
A 1.4V, 2.4/5 GHz, 90nm CMOS system in a package transceiver for next generation WLAN
Author :
Ravi, A. ; Carlton, B.R. ; Palaskas, Y. ; Banerjee, G. ; Bishop, R.E. ; Elmala, M.A. ; Nicholls, R.B. ; Rippke, I.A. ; Lakdawala, H. ; Franca-Neto, L.M. ; Taylor, S.S. ; Soumyanath, K.
Author_Institution :
Intel R&D, Intel Corp., Hillsboro, OR, USA
Abstract :
We present a 2.4/5GHz system in a package transceiver with integrated 5GHz PA and 10-100MHz signal bandwidth, suitable for next generation WLAN applications. The RXs achieve better than -71dBm sensitivity for 64 QAM while drawing 120mA from a 1.4 supply in a 90nm CMOS process. The integrated 3.3V, 5GHz PA delivers 9dBm average power with an EVM better than -25dB. The transceiver incorporates de-convolved calibration of quadrature mismatches in the transmitter and receiver for improved performance and yield. Micro strip passives are integrated into a flip chip package for both LNA and PA matching elements.
Keywords :
CMOS integrated circuits; flip-chip devices; microwave integrated circuits; power amplifiers; quadrature amplitude modulation; transceivers; wireless LAN; 1.4 V; 10 to 100 mHz; 120 mA; 2.4 GHz; 3.3 V; 5 GHz; 90 nm; CMOS process; CMOS system in a package transceiver; LNA matching element; PA matching element; QAM; flip chip package; low noise amplifier; microstrip passives; power amplifier; quadrature mismatch; receiver; transmitter; wireless LAN; Bandwidth; CMOS process; Calibration; Flip chip; Packaging; Quadrature amplitude modulation; Strips; Transceivers; Transmitters; Wireless LAN;
Conference_Titel :
VLSI Circuits, 2005. Digest of Technical Papers. 2005 Symposium on
Print_ISBN :
4-900784-01-X
DOI :
10.1109/VLSIC.2005.1469389
