Title :
Optimum microstrip interconnects
Author :
Nelson, S. ; Youngblood, M. ; Pavio, J. ; Larson, B. ; Kottman, R.
Author_Institution :
Texas Instrum., Dallas, TX, USA
Abstract :
A simple, automated assembly technique that solves the high VSWR (voltage standing wave ratio) and insertion loss problems associated with variable wire inductance in microwave assemblies has been developed. The theory, design, and fabrication of optimum microstrip interconnects from 2 to 20 GHz are discussed. Microstrip interconnects, modeled and measured, are shown to achieve VSWRs of 1:2:1 through 20 GHz, even when several interconnects are cascaded. The technique is tolerant of gap variations between substrates and a misalignment of the microstrip conductors.<>
Keywords :
assembling; hybrid integrated circuits; integrated circuit technology; microwave integrated circuits; packaging; strip line components; 2 to 20 GHz; MIC; SHF; automated assembly technique; fabrication; high VSWR; insertion loss; microwave assemblies; optimum microstrip interconnects; variable wire inductance; voltage standing wave ratio; Assembly; Bonding; Capacitance; Inductance; Insertion loss; Integrated circuit interconnections; Microstrip; Radio frequency; Shunt (electrical); Wire;
Conference_Titel :
Microwave Symposium Digest, 1991., IEEE MTT-S International
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-87942-591-1
DOI :
10.1109/MWSYM.1991.147199
