• DocumentCode
    3552003
  • Title

    Silicon planar integrated circuitry - Devices and circuits fabricated using multiple epitaxial and diffusion techniques

  • Author

    Hill, L.O. ; LeBlanc, G.P. ; Moore, S.

  • Author_Institution
    Westinghouse Electric Corp., Newbury Park, Calif.
  • fYear
    1962
  • fDate
    25-27 Oct. 1962
  • Firstpage
    34
  • Lastpage
    34
  • Abstract
    By the alternate application of epitaxial growth and selective diffusion, it is possible to construct integrated circuits layer by layer. In this manner, the electrical properties of internal regions can be modified and multiple epitaxial layers electrically isolated. The additional freedom resulting from the ability to work within the silicon block opens new modes of device design. This technique has been successfully used to construct both bipolar and unipolar field-effect transistors. Adjacent but electrically isolated active devices exhibit excellent and well matched characteristics. The characteristics of typical devices and their method of fabrication will be discussed. These active devices are taken from two integrated circuits--first, a differential amplifier stage containing two n-p-n bipolar transistors and five resistors, and second, a differential amplifier stage containing two p-channel, n-gate unipolar transistors and six resistors. Possible future applications of this technique will be presented. The advantages and disadvantages of the technique will be pointed out.
  • Keywords
    Application specific integrated circuits; Bipolar transistor circuits; Bipolar transistors; Differential amplifiers; Epitaxial growth; Epitaxial layers; FETs; Fabrication; Resistors; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1962 International
  • Conference_Location
    Washington, DC, USA
  • Type

    conf

  • DOI
    10.1109/IEDM.1962.187294
  • Filename
    1473321