DocumentCode
3552590
Title
Implantation damage in InP: thermal stability effects
Author
Goltzené, A. ; Meyer, B. ; Schwab, C.
Author_Institution
Univ. Louis Pasteur, Strasbourg, France
fYear
1991
fDate
8-11 Apr 1991
Firstpage
664
Lastpage
667
Abstract
The decay of fast-neutron-induced V p and P In defects during conventional thermal isochronal anneals was monitored using conventional electron paramagnetic resonance. An optimum temperature for the removal of the lattice damage introduced by neutron irradiation in undoped InP is found at 450°C. Annealing at higher temperatures reveals further bulk effects. During heat treatment, pinning of the Fermi level on the P In0%+ midgap level is observed
Keywords
Fermi level; III-V semiconductors; annealing; indium compounds; ion beam effects; ion implantation; neutron effects; paramagnetic resonance of defects; vacancies (crystal); 450 C; Fermi level pinning; III-V semiconductor; InP; electron paramagnetic resonance; fast neutron induced damage; ion implantation damage simulation; lattice damage removal; optimum temperature; thermal isochronal anneals; thermal stability effects; Annealing; Electrons; Heat treatment; Indium phosphide; Lattices; Monitoring; Neutrons; Paramagnetic resonance; Temperature; Thermal stability;
fLanguage
English
Publisher
ieee
Conference_Titel
Indium Phosphide and Related Materials, 1991., Third International Conference.
Conference_Location
Cardiff
Print_ISBN
0-87942-626-8
Type
conf
DOI
10.1109/ICIPRM.1991.147462
Filename
147462
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