DocumentCode
3552897
Title
High-yield-processed bipolar LSI arrays
Author
Dingwall, A.G.F.
Author_Institution
RCA Electronic Components, Somerville, N. J.
Volume
14
fYear
1968
fDate
1968
Firstpage
82
Lastpage
82
Abstract
This paper describes the results of an engineering program for fabricating bipolar LSI arrays consisting of 100 to 200 gates from fixed interconnect masks. The arrays are high-speed ECL arithmetic registers to be used in the demonstration LIMAC (Large Integrated Monolithic Array Computer) for the Air Force. Special processing techniques were found to improve yields sufficiently to make direct fabrication of these complex devices practicable.
Keywords
Ceramics; Electronic packaging thermal management; Fabrication; Integrated circuit packaging; Large scale integration; Semiconductor device packaging; Substrates; Surface resistance; Thermal force; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1968 International
Type
conf
DOI
10.1109/IEDM.1968.188009
Filename
1475534
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