DocumentCode
3553772
Title
Bulk acoustic delay lines utilizing sub-micron platelet LiNbO3 transducer
Author
Huang, H.C. ; Knox, J.D. ; Turski, Z.
Author_Institution
RCA Laboratories, Princeton, New Jersey
Volume
19
fYear
1973
fDate
1973
Firstpage
263
Lastpage
265
Abstract
This article describes the fabrication technology and preliminary results of a new generation of bulk acoustic delay lines. The approach being taken is to use magnesium aluminate spinel (MgAl2 O4 ) as the delay medium and to fabricate shear wave transducers from bulk lithium niobate (LiNbO3 ). We have recently developed a technology for fabrication of sub-micron bulk platelet instead of thin film transducers. Lithium niobate transducers with thicknesses as thin as 0.2 µm have been achieved. This technology employs a novel bonding technique, the room temperature vacuum bond, and a carefully controlled process of ion beam milling. Bulk wave acoustic delay lines consisting of LiNbO3 transducers on spinel substrate have yielded very wideband and low loss operation in S-, C- and X-band frequencies.
Keywords
Acoustic transducers; Bonding; Delay lines; Fabrication; Lithium niobate; Magnesium; Propagation delay; Temperature control; Transistors; Vacuum technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1973 International
Type
conf
DOI
10.1109/IEDM.1973.188703
Filename
1477580
Link To Document