• DocumentCode
    3553772
  • Title

    Bulk acoustic delay lines utilizing sub-micron platelet LiNbO3transducer

  • Author

    Huang, H.C. ; Knox, J.D. ; Turski, Z.

  • Author_Institution
    RCA Laboratories, Princeton, New Jersey
  • Volume
    19
  • fYear
    1973
  • fDate
    1973
  • Firstpage
    263
  • Lastpage
    265
  • Abstract
    This article describes the fabrication technology and preliminary results of a new generation of bulk acoustic delay lines. The approach being taken is to use magnesium aluminate spinel (MgAl2O4) as the delay medium and to fabricate shear wave transducers from bulk lithium niobate (LiNbO3). We have recently developed a technology for fabrication of sub-micron bulk platelet instead of thin film transducers. Lithium niobate transducers with thicknesses as thin as 0.2 µm have been achieved. This technology employs a novel bonding technique, the room temperature vacuum bond, and a carefully controlled process of ion beam milling. Bulk wave acoustic delay lines consisting of LiNbO3transducers on spinel substrate have yielded very wideband and low loss operation in S-, C- and X-band frequencies.
  • Keywords
    Acoustic transducers; Bonding; Delay lines; Fabrication; Lithium niobate; Magnesium; Propagation delay; Temperature control; Transistors; Vacuum technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1973 International
  • Type

    conf

  • DOI
    10.1109/IEDM.1973.188703
  • Filename
    1477580