DocumentCode
3553809
Title
Characteristics of high performance microwave transistors fabricated by ion implantation
Author
Sigmon, T.W.
Author_Institution
Hewlett Packard Laboratories, Palo Alto, California
Volume
19
fYear
1973
fDate
1973
Firstpage
387
Lastpage
389
Abstract
In this paper the characteristics and fabrication of implanted microwave transistors are discussed. By use of arsenic implanted emitter and boron implanted base, devices can be fabricated with fT between 4.0 and 7.0 GHz, while fmax ranges from 18.0 to 25.5 GHz. Noise figures range from 3.8 to 5.5 db at 4 GHz. Results will be presented from devices implanted with arsenio emitter energies from 27 to 30 KeV and boron base energies from 20 to 38 KeV. Boron base doses range from
to 1013B/cm2, while emitter dose was
to
As/cm2. It was found that (QE /DE )eff ranged from
cm-4sec for all emitter implants. A discussion of improvement of uniformity and yield is included along with some wafer yield data.
to 1013B/cm2, while emitter dose was
to
As/cm2. It was found that (Q
cm-4sec for all emitter implants. A discussion of improvement of uniformity and yield is included along with some wafer yield data.Keywords
Annealing; Boron; Fabrication; Implants; Ion implantation; Metallization; Microwave devices; Microwave transistors; Noise figure; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1973 International
Type
conf
DOI
10.1109/IEDM.1973.188736
Filename
1477613
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