DocumentCode
3553986
Title
Reliability studies of one-micron Schottky gate GaAs FET
Author
Kozu, Hideaki ; Nagasako, Isamu ; Ogawa, Masaki ; Kawamura, Nobuo
Author_Institution
Nippon Electric Co., Ltd., Kawasaki, JAPAN
Volume
21
fYear
1975
fDate
1975
Firstpage
247
Lastpage
250
Abstract
Failure modes have been studied experimentally on a low-noise one-micron aluminum gate GaAs FET. Several life tests, including high temperature storage, power burn-in, and gate biasing at elevated temperature, were carried out on more than 200 samples. It has been revealed that gradual degradation of source and drain contact resistance is the major life-determining failure mode. MTTF was estimated to be about 109hours for channel temperature of 80°C. Surge tests were also carried out. In some specimens, reversible drift of electrical parameters was observed. This instability seems to be related with deep level trapping centers in the GaAs epitaxial layer substrate interface.
Keywords
Aluminum; Contact resistance; Degradation; Epitaxial layers; FETs; Gallium arsenide; Life testing; Substrates; Surges; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1975 International
Type
conf
DOI
10.1109/IEDM.1975.188871
Filename
1478232
Link To Document