DocumentCode
3554290
Title
Electron gun with bonded nonintercepting control grid
Author
Miram, G.V. ; Lien, E.L.
Author_Institution
Varian Associates, Palo Alto, California
Volume
22
fYear
1976
fDate
1976
Firstpage
647
Lastpage
650
Abstract
The bonded grid consists of a metal-insulator-metal sandwich attached directly to an impregnated tungsten cathode. The metallic top surface of the grid structure is the control grid, and the metallic surface on the bottom provides a diffusion barrier for barium between the cathode and the insulator. The major advantage of this design approach is that the close tolerance required in grid cathode spacings is easily obtained and maintained with the cathode in hot condition. The first bonded grid structure described in the paper was developed for a microwave triode having a grid-to-cathode spacing of 2 mils. The dimensions of the grid cells are 5 × 35 mils. The grid structure consists of a thin wafer of anisotropic boron nitride insulator metallized on both sides by RF sputtering. The fabrication techniques were later extended to construction of convergent guns for linear-beam tubes. The progress and the problem areas experienced in both phases of this program are discussed.
Keywords
Anisotropic magnetoresistance; Barium; Boron; Cathodes; Electrons; Insulation; Metal-insulator structures; Metallization; Tungsten; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1976 International
Type
conf
DOI
10.1109/IEDM.1976.189129
Filename
1478841
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