DocumentCode
3554934
Title
A high-performance MOS technology for 16K static RAM
Author
Liu, S.S. ; Smith, R.J. ; Pashley, R.D. ; Shappir, J. ; Fu, C.H. ; Kokkonen, K.R.
Author_Institution
Intel Corp., Santa Clara, Calif.
Volume
25
fYear
1979
fDate
1979
Firstpage
352
Lastpage
354
Abstract
A scaled double-poly MOS technology has been developed which features a static memory cell size of 1.5 mil2with 4µ design rules using conventional photolithographic techniques. The technology scales the gate oxide thickness to 400Å and poly-Si channel length to 2.1µ with arsenic source-drain and self-aligned poly-poly via contact. Four different types of transistors are implemented to enhance circuit design versatility. Hot electron failures and soft errors do not limit the applicability of the technology.
Keywords
Circuit synthesis; Doping; Electrons; Graphics; Integrated circuit interconnections; MOS devices; Printers; Printing; Random access memory; Read-write memory;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1979 Internationa
Type
conf
DOI
10.1109/IEDM.1979.189623
Filename
1480488
Link To Document