DocumentCode :
3556787
Title :
Self-aligned processes for the GaAs gate FET
Author :
Baratte, H. ; La Tulipe, D.C. ; Knoedler, C.M. ; Jackson, T.N. ; Frank, D.J. ; Solomon, P.M. ; Wright, S.L.
Author_Institution :
IBM T.J. Watson Research Center, Yorktown Heights, NY
Volume :
32
fYear :
1986
fDate :
1986
Firstpage :
444
Lastpage :
447
Abstract :
We have developed cold gate and refractory gate self-aligned processes for the GaAs-based SISFET. Using either of these approaches, we have demonstrated 0.7 µm gate length devices with near-zero threshold voltage, transconductance of 280mS/mm at 300K and 400mS/mm at 77K and low gate leakage. We have also fabricated 23-stage ring oscillators which yielded delays of 35ps/gate and speed-power products of 10fJ/gate at 300K.
Keywords :
Annealing; Contact resistance; Etching; FETs; Gallium arsenide; Implants; Insulation; Ohmic contacts; Threshold voltage; Transconductance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1986 International
Type :
conf
DOI :
10.1109/IEDM.1986.191215
Filename :
1486473
Link To Document :
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