DocumentCode :
3557077
Title :
BSA Technology for sub-100nm deep base bipolar transistors
Author :
Takemura, H. ; Ohi, S. ; Sugiyama, M. ; Tashiro, T. ; Nakamae, M.
Author_Institution :
NEC Corporation, Kanagawa, Japan
Volume :
33
fYear :
1987
fDate :
1987
Firstpage :
375
Lastpage :
378
Abstract :
This paper will describe a novel self-aligned technology, BSA (BSG Self-Aligned) technology. The BSA technology makes it possible to realize the self-aligned bipolar transistors having sub- 100nm deep base junction and to solve the problems in lateral and vertical scaling down of self-aligned transistors. The BSA technology is featured by the use of BSG film not only as a sidewall spacer but also as a diffusion source to form both the intrinsic base and p+-link regions by rapid thermal annealing (RTA), simultaneously. The typical BSA transistor having sub-100nm deep base junction showed 70 of hFE, 7V of BVCEOand 3V of BVEBO, respectively.
Keywords :
Atomic layer deposition; Bipolar transistors; Boron; Etching; Fabrication; Ion implantation; National electric code; Parasitic capacitance; Rapid thermal annealing; Space technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1987 International
Type :
conf
DOI :
10.1109/IEDM.1987.191435
Filename :
1487393
Link To Document :
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