Title :
Uprating of a single inline memory module
Author :
Pends?©, Neeraj ; Thomas, Dawn ; Das, Diganta ; Pecht, Michael G.
Author_Institution :
CALCE Electron. Products & Syst. Center, Maryland Univ., College Park, MD, USA
fDate :
6/1/2002 12:00:00 AM
Abstract :
Uprating is the process of assessing the ability of a part to meet the functionality and performance requirements for the application in which the part is used outside the manufacturer-specified temperature range. Uprating is considered when there are no electronic parts rated to operate at the required application temperature and other alternatives are found to be technically incompatible or inadequate. This paper presents a case study of an uprating assessment of single inline memory modules. The focus of the study was to determine if the modules could operate at extended temperatures for extended periods of time. The results established the ability of the parts to function at high temperature for extended periods
Keywords :
DRAM chips; conformance testing; high-temperature electronics; integrated circuit reliability; integrated circuit testing; modules; DRAM parts; application temperature; electronic parts rating; extended temperature operation; functionality requirements; memory testing; parameter conformance; parameter recharacterization; performance requirements; reliability; single inline memory module; stress balancing; uprating; Aerospace industry; Defense industry; Electronic equipment manufacture; IEC; Manufacturing industries; Military computing; Random access memory; Semiconductor device manufacture; Temperature distribution; Testing;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Conference_Location :
6/1/2002 12:00:00 AM
DOI :
10.1109/TCAPT.2002.1010016
