DocumentCode
3559930
Title
Closed-Loop Modeling in Future Automation System Engineering and Validation
Author
Vyatkin, Valeriy ; Hanisch, Hans-Michael ; Pang, Cheng ; Yang, Chia-Han
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Auckland, Auckland
Volume
39
Issue
1
fYear
2009
Firstpage
17
Lastpage
28
Abstract
This paper presents a new framework for design and validation of industrial automation systems based on systematic application of formal methods. The engineering methodology proposed in this paper is based on the component design of automated manufacturing systems from intelligent mechatronic components. Foundations of such componentspsila information infrastructure are the new IEC 61499 architecture and the automation object concept. It is illustrated in this paper how these architectures, in conjunction with other advanced technologies, such as Unified Modeling Language, Simulink, and net condition/event systems, form a framework that enables pick-and-place design, simulation, formal verification, and deployment with the support of a suite of software tools. The key feature of the framework is the inherent support of formal validation techniques achieved on account of automated transformation among different system models. The paper appeals to developers of automation systems and automation software tools via showing the pathway to improve the system development practices by combining several design and validation methodologies and technologies.
Keywords
factory automation; formal verification; production engineering computing; software tools; IEC 61499 architecture; automated manufacturing systems; closed-loop modeling; formal methods; formal validation techniques; formal verification; future automation system engineering; industrial automation systems; intelligent mechatronic components; software tools; Manufacturing automation; mechatronics; software reusability; software verification and validation (V&V);
fLanguage
English
Journal_Title
Systems, Man, and Cybernetics, Part C: Applications and Reviews, IEEE Transactions on
Publisher
ieee
Conference_Location
12/16/2008 12:00:00 AM
ISSN
1094-6977
Type
jour
DOI
10.1109/TSMCC.2008.2005785
Filename
4717249
Link To Document