• DocumentCode
    3560580
  • Title

    Enhanced Power and Breakdown in III-N RF Switches With a Slow Gate

  • Author

    Sattu, A. ; Deng, J. ; Billingsley, D. ; Yang, J. ; Shur, M. ; Gaska, R. ; Simin, G.

  • Author_Institution
    Sensor Electron. Technol. Inc., Columbia, SC, USA
  • Volume
    32
  • Issue
    6
  • fYear
    2011
  • fDate
    6/1/2011 12:00:00 AM
  • Firstpage
    749
  • Lastpage
    751
  • Abstract
    We show that III-nitride radio-frequency switches with a composite slow/fast gate have higher maximum switching power and breakdown voltage compared with conventional switches of the same type. The composite gate design includes an additional “slow gate” electrode formed under the metal gate using a low-conducting InGaN layer. The “slow gate” covers the entire source-drain spacing. The addition of the “slow gate” layer not only offers a lower insertion loss and higher isolation but, as shown in this letter, also increases the power handling capability by “delaying” switch self-modulation under high-power stress. We also show that, the “slow gate” design increases breakdown voltage.
  • Keywords
    gallium compounds; indium compounds; microwave switches; III-N RF switches; III-nitride radiofrequency switches; InGaN; breakdown enhancement; breakdown voltage; composite gate design; composite slow-fast gate; high-power stress; metal gate; power enhancement; power handling capability; switch self-modulation; Electric potential; Gallium nitride; HEMTs; Logic gates; MMICs; MODFETs; Radio frequency; $V_{rm BD}$; AlGaN/GaN; monolithic microwave integrated circuit (MMIC); power handling; radio-frequency switch;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • Conference_Location
    4/21/2011 12:00:00 AM
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2011.2126557
  • Filename
    5753916