DocumentCode
3560580
Title
Enhanced Power and Breakdown in III-N RF Switches With a Slow Gate
Author
Sattu, A. ; Deng, J. ; Billingsley, D. ; Yang, J. ; Shur, M. ; Gaska, R. ; Simin, G.
Author_Institution
Sensor Electron. Technol. Inc., Columbia, SC, USA
Volume
32
Issue
6
fYear
2011
fDate
6/1/2011 12:00:00 AM
Firstpage
749
Lastpage
751
Abstract
We show that III-nitride radio-frequency switches with a composite slow/fast gate have higher maximum switching power and breakdown voltage compared with conventional switches of the same type. The composite gate design includes an additional “slow gate” electrode formed under the metal gate using a low-conducting InGaN layer. The “slow gate” covers the entire source-drain spacing. The addition of the “slow gate” layer not only offers a lower insertion loss and higher isolation but, as shown in this letter, also increases the power handling capability by “delaying” switch self-modulation under high-power stress. We also show that, the “slow gate” design increases breakdown voltage.
Keywords
gallium compounds; indium compounds; microwave switches; III-N RF switches; III-nitride radiofrequency switches; InGaN; breakdown enhancement; breakdown voltage; composite gate design; composite slow-fast gate; high-power stress; metal gate; power enhancement; power handling capability; switch self-modulation; Electric potential; Gallium nitride; HEMTs; Logic gates; MMICs; MODFETs; Radio frequency; $V_{rm BD}$ ; AlGaN/GaN; monolithic microwave integrated circuit (MMIC); power handling; radio-frequency switch;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
Conference_Location
4/21/2011 12:00:00 AM
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2011.2126557
Filename
5753916
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