Passive multimode fiber-to-edge-emitting laser alignment based on a multilayer LTCC substrate

Packaging forms a large share of the total manufacturing costs of optoelectronic modules. This especially concerns manufacturing techniques, where active optical power monitoring is required during the assembly of components. Passive alignment offers advantages for high volume manufacturing. However, high-performance modules require high-precision alignment structures. We studied methods for manufacturing horizontal alignment structures using low temperature co-fired ceramic (LTCC) technology. In this paper, we present the manufacture of the LTCC test parts and the experimental results of the pigtailing of an edge-emitting diode laser with a 62.5/125 μm multimode fiber. Standard LTCC manufacturing equipment was used to process the precision substrates. Optical tolerance analyses based on coupling efficiency simulations and measurements were performed. The results of these analyses are compared to the measured dimensions of the LTCC structures.