• DocumentCode
    3565155
  • Title

    Area dependence of thermal stability factor in perpendicular STT-MRAM analyzed by bi-directional data flipping model

  • Author

    Tsunoda, K. ; Aoki, M. ; Noshiro, H. ; Iba, Y. ; Fukuda, S. ; Yoshida, C. ; Yamazaki, Y. ; Takahashi, A. ; Hatada, A. ; Nakabayashi, M. ; Tsuzaki, Y. ; Sugii, T.

  • Author_Institution
    Low-power Electron. Assoc. & Project (LEAP), Tsukuba, Japan
  • fYear
    2014
  • Abstract
    We report a statistical analysis of the thermal stability factor (Δ) for the top-pinned perpendicular magnetic tunnel junction (p-MTJ). By using a bi-directional data flipping model, the data retention characteristics of the “0” and “1” states can be fitted separately, including the saturation of failure probability. With the help of a resistance evaluation for the 16-kbit MTJ array, it became clear that the Δ of the “1” state increased as the device area increased, whereas the Δ of the “0” state remains constant regardless of the size. Moreover, we found that the p-MTJ exhibited a much smaller variation of Δ (9.6 ~ 14.3%) compared with the in-plane MTJ. Variations of Δ in both states decreased as the area increased. In combination with an intense magnetic measurement for the discrete monitor devices, the key parameter to increase the Δ and suppress its variation was investigated.
  • Keywords
    MRAM devices; magnetic tunnelling; statistical analysis; thermal stability; STT-MRAM; bi-directional data flipping model; data retention; perpendicular magnetic tunnel junction; statistical analysis; thermal stability; Arrays; Bidirectional control; Junctions; Niobium; Resistance; Switches; Thermal stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2014 IEEE International
  • Type

    conf

  • DOI
    10.1109/IEDM.2014.7047082
  • Filename
    7047082