Title :
Direct observation of self-heating in III–V gate-all-around nanowire MOSFETs
Author :
Shin, S.H. ; Masuduzzaman, M. ; Wahab, M.A. ; Maize, K. ; Gu, J.J. ; Si, M. ; Shakouri, A. ; Ye, P.D. ; Alam, M.A.
Author_Institution :
Dept. of ECE, Purdue Univ., West Lafayette, IN, USA
Abstract :
Gate-all-around MOSFETs use multiple nanowires to achieve target ION, along with excellent 3D electrostatic control of the channel. Although self-heating effect (SHE) has been a persistent concern, the existing characterization methods, based on indirect measure of mobility and specialized test structures, do not offer adequate spatio-temporal resolution. In this paper, we develop an ultra-fast, high resolution thermo-reflectance (TR) imaging technique to (i) directly observe the increase in local surface temperature of the GAA-FET with different number of nanowires (NWs), (ii) characterize/interpret the time constants of heating and cooling through high resolution transient measurements, (iii) identify critical paths for heat dissipation, and (iv) detect in-situ time-dependent breakdown of individual NW. Our approach also allows indirect imaging of quasi-ballistic transport and corresponding drain/source asymmetry of self-heating. Combined with the complementary approaches that probe the internal temperature of the NW, the TR-images offer a high resolution map of self-heating in the surround-gate devices with unprecedented precision, necessary for validation of electro-thermal models and optimization of devices and circuits.
Keywords :
MOSFET; ballistic transport; cooling; infrared imaging; nanowires; thermoreflectance; 3D electrostatic control; GAA-FET; drain-source asymmetry; gate-all-around MOSFET; heat dissipation; high resolution transient measurements; in-situ time-dependent breakdown; indirect imaging; local surface temperature; nanowires; quasi-ballistic transport; self-heating effect; spatio-temporal resolution; surround-gate devices; time constants; ultra-fast high resolution thermoreflectance imaging technique; Cooling; Heating; Image resolution; Light emitting diodes; Logic gates; Temperature measurement; Transient analysis;
Conference_Titel :
Electron Devices Meeting (IEDM), 2014 IEEE International
DOI :
10.1109/IEDM.2014.7047088