DocumentCode
3565728
Title
Direct metallization technology introduction
Author
Beston Liu
fYear
2014
Firstpage
351
Lastpage
354
Abstract
This paper provides an overview of three kind of direct metallization processes, summarize the process principle and process flow of palladium activated direct metallization, conductive polymer direct metallization and carbon black activated direct metallization processes. The advantages and disadvantages of three kinds of processes were compared, and the investigation of selective organic conductive coating reliability.
Keywords
activated carbon; conducting polymers; electroplating; metallisation; carbon black activated direct metallization processes; conductive polymer direct metallization; palladium activated direct metallization; process flow; process principle; selective organic conductive coating reliability; Carbon; Copper; Graphite; Metallization; Palladium; Polymers; Surface treatment; Black Hole; Conductive Polymer; Direct Metallization; palladium;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
Type
conf
DOI
10.1109/IMPACT.2014.7048345
Filename
7048345
Link To Document