Title :
The novel solvent-soluble polyimide characterized by low Dk, low Df, and high heat resistance
Author_Institution :
HB Group R&D Dept., Arakawa Chem. Ind., Ltd., Osaka, Japan
Abstract :
Enlargement of transmitting data and speeding up of transmission frequency in circuits is rapidly progressing as advances of communication and information technology. Consequently, for print circuit boards corresponded to high frequency transmission, circuit design and material option is increasingly important.
Keywords :
permittivity; printed circuit design; circuit design; communication and information technology; data transmission; dielectric constant; dielectric tangent; high frequency transmission; high heat resistance; low Df heat resistance; low Dk heat resistance; material option; printed circuit boards; solvent-soluble polyimide characterization; speeding transmission; Dielectrics; Films; Polyimides; Resistance heating; Solvents;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
DOI :
10.1109/IMPACT.2014.7048361
