• DocumentCode
    3565857
  • Title

    Polymer TSV fabrication scheme with its electrical and reliability test vehicle

  • Author

    Shih-Wei Lee ; Jian-Yu Shih ; Ching-Te Chuang ; Wei Hwang ; Jin-Chern Chiou ; Kuo-Hua Chen ; Chi-Tsung Chiu ; Kuan-Neng Chen

  • Author_Institution
    Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2014
  • Firstpage
    282
  • Lastpage
    285
  • Abstract
    In this research, a novel process scheme for polymer TSV fabrication is proposed to solve the difficulty of polymer liner formation in TSV technology. The corresponding structure shows great manufacturability to replace traditional fabrication approach. In addition, Kelvin structure of the daisy chain is designed for evaluating electrical performance and reliability. Moreover, daisy chain with dummy TSV is designed to verify the impact of TSV pitch on TSV fabrication by using electrical measurement. The reliability tests include thermal cycling and humidity test to verify the quality of proposed polymer TSV design. Finally, a void-free polymer TSV with uniform liner formation is successfully fabricated and demonstrated.
  • Keywords
    polymers; reliability; three-dimensional integrated circuits; Kelvin structure; TSV technology; daisy chain; electrical test vehicle; humidity test; polymer TSV fabrication scheme; polymer liner formation; reliability test vehicle; thermal cycling; Cavity resonators; Materials reliability; Polymers; Reliability engineering; Resistance; Through-silicon vias;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
  • Type

    conf

  • DOI
    10.1109/IMPACT.2014.7048407
  • Filename
    7048407