DocumentCode
3567673
Title
Test method recommendations for the evaluation of packaging materials used for small static sensitive electronic components
Author
Numaguchi, Toshikazu ; Murakami, Toshio ; Swenson, David E. ; Adams, James T.
Author_Institution
Sumitomo 3M Co., Ltd., Sagamihara, Japan
fYear
2012
Firstpage
1
Lastpage
7
Abstract
Many types of packaging materials including IC trays and pocket tape are used for protection of electronic components that cannot be evaluated with existing test methods. It is important for the packaging material manufacturer and the end user to have industry accepted test methods for the evaluation of these items.
Keywords
integrated circuit packaging; integrated circuit testing; IC trays; packaging material evaluation; pocket tape; small static sensitive electronic component protection; test method recommendations; Electrical resistance measurement; Electrodes; Flanges; Materials; Packaging; Probes; Resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2012 34th
ISSN
0739-5159
Print_ISBN
978-1-4673-1467-1
Type
conf
Filename
6333304
Link To Document