DocumentCode :
3567673
Title :
Test method recommendations for the evaluation of packaging materials used for small static sensitive electronic components
Author :
Numaguchi, Toshikazu ; Murakami, Toshio ; Swenson, David E. ; Adams, James T.
Author_Institution :
Sumitomo 3M Co., Ltd., Sagamihara, Japan
fYear :
2012
Firstpage :
1
Lastpage :
7
Abstract :
Many types of packaging materials including IC trays and pocket tape are used for protection of electronic components that cannot be evaluated with existing test methods. It is important for the packaging material manufacturer and the end user to have industry accepted test methods for the evaluation of these items.
Keywords :
integrated circuit packaging; integrated circuit testing; IC trays; packaging material evaluation; pocket tape; small static sensitive electronic component protection; test method recommendations; Electrical resistance measurement; Electrodes; Flanges; Materials; Packaging; Probes; Resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2012 34th
ISSN :
0739-5159
Print_ISBN :
978-1-4673-1467-1
Type :
conf
Filename :
6333304
Link To Document :
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