• DocumentCode
    3569065
  • Title

    Investigation of the morphology in AlN filled epoxy based composite materials

  • Author

    Andritsch, Thomas ; Sixiang Zhang ; Kochetov, Roman

  • Author_Institution
    Electron. & Comput. Sci., Univ. of Southampton, Southampton, UK
  • fYear
    2015
  • Firstpage
    321
  • Lastpage
    324
  • Abstract
    This paper investigates the structure of bisphenol-A epoxy based composites with low amounts of aluminium nitride (from 0.5 to 10 % by weight), which were originally chosen for their high thermal conductivity. Aim of this research was to investigate the applicability of interphase models on amorphous thermosets. The filler content was confirmed with thermogravimetric analysis, and previous measurements of the dielectric properties re-examined. The results of transmission electron microscopy and differential scanning calorimetry suggest that epoxy based insulation materials don´t exhibit distinct interfacial restructuring on the nanoscale, but rather a widespread change of the micro structure, even for smallest amounts of additives.
  • Keywords
    additives; aluminium compounds; differential scanning calorimetry; filled polymers; permittivity; polymer structure; thermal conductivity; transmission electron microscopy; AIN filled epoxy based composite materials; additives; amorphous thermosets; bisphenol-A epoxy based composite structure; dielectric properties; differential scanning calorimetry; epoxy based insulation materials; interphase models; microstructure; morphology; thermal conductivity; thermogravimetric analysis; transmission electron microscopy; Dielectrics; Moisture measurement; Permittivity; Plastics; DSC; TGA; composite materials; epoxy resin; interphase; nanodielectrics; polymers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference (EIC), 2015 IEEE
  • Print_ISBN
    978-1-4799-7352-1
  • Type

    conf

  • DOI
    10.1109/ICACACT.2014.7223518
  • Filename
    7223518