Infrared solder joint inspection on surface mount printed circuit boards

Author

Liu, Roger Z. ; Shi, Y.Q. ; Kosonocky, W.F. ; Higgins, F.P.

Author_Institution

AT&T CommVault Syst., Eatontown, NJ, USA

Volume

1

fYear

1995

Firstpage

145

Abstract

This paper reported some experimental work and the result of applying an infrared inspection system developed in the Machine Vision Laboratory, NJIT to inspect an experimental surface mount solder joint circuit board designed and manufactured by the Machine Vision Group, AT&T Bell Laboratories, Princeton, NJ. The infrared inspection system which consists of a CCD infrared camera, a Datacube image processing system, and a SUN Station is introduced. New features selected for the infrared inspection, the statistical pattern recognition algorithm utilized and the related software are presented as well. It has been demonstrated that infrared imaging technique can identify solder joints of surface mount circuit boards according to their solder volume. The correct classification rate was found to be in the range of 89% to 100%. To our knowledge, the infrared inspection of surface mount PCBs has not been reported in the vision literature

Keywords

automatic optical inspection; infrared imaging; pattern classification; printed circuit manufacture; printed circuit testing; soldering; surface mount technology; CCD infrared camera; Datacube image processing system; SUN Station; classification; infrared imaging; infrared inspection; machine vision; software; solder joints; statistical pattern recognition algorithm; surface mount printed circuit boards; Charge coupled devices; Charge-coupled image sensors; Image processing; Infrared imaging; Inspection; Machine vision; Manufacturing processes; Printed circuits; Pulp manufacturing; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems, 1995., Proceedings., Proceedings of the 38th Midwest Symposium on

Print_ISBN

0-7803-2972-4

Type

conf

DOI

10.1109/MWSCAS.1995.504399

Filename

504399