DocumentCode :
3571971
Title :
Software defect prediction using semi-supervised learning with dimension reduction
Author :
Huihua Lu ; Cukic, Bojan ; Culp, Mark
Author_Institution :
Lane Dept. of Comput. Sci. & Electr. Eng., West Virginia Univ., Morgantown, WV, USA
fYear :
2012
Firstpage :
314
Lastpage :
317
Abstract :
Accurate detection of fault prone modules offers the path to high quality software products while minimizing non essential assurance expenditures. This type of quality modeling requires the availability of software modules with known fault content developed in similar environment. Establishing whether a module contains a fault or not can be expensive. The basic idea behind semi-supervised learning is to learn from a small number of software modules with known fault content and supplement model training with modules for which the fault information is not available. In this study, we investigate the performance of semi-supervised learning for software fault prediction. A preprocessing strategy, multidimensional scaling, is embedded in the approach to reduce the dimensional complexity of software metrics. Our results show that the semi-supervised learning algorithm with dimension-reduction preforms significantly better than one of the best performing supervised learning algorithms, random forest, in situations when few modules with known fault content are available for training.
Keywords :
learning (artificial intelligence); software metrics; software quality; dimension reduction; fault content; fault prone module detection; high quality software products; model training; multidimensional scaling; preprocessing strategy; random forest; semisupervised learning; software defect prediction; software fault prediction; software metrics dimensional complexity; software modules availability; Software fault prediction; dimension reduction; semi-supervised learning; software metrics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Automated Software Engineering (ASE), 2012 Proceedings of the 27th IEEE/ACM International Conference on
Print_ISBN :
978-1-4503-1204-2
Type :
conf
DOI :
10.1145/2351676.2351734
Filename :
6494944
Link To Document :
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