Title :
Interconnect Geometric Parameters Optimization
Author :
Delorme, Nicolas ; Belleville, Mare
Author_Institution :
LETI-CEA-GRENOBLE, 17 avenue des Martyrs, 38054 Grenoble CEDEX 9, France
Abstract :
The existence of an optimum line aspect ratio that minimizes interconnect delay for a given configuration is demonstrated. We study the sensitivity of this ratio to several line configurations and technological variations. The variation of far-end crosstalk voltage is also investigated with respect to line aspect ratio.
Keywords :
Capacitance; Crosstalk; Delay effects; Design optimization; Dielectrics; Electromagnetic analysis; Geometry; Guidelines; Solid modeling; Voltage;
Conference_Titel :
Solid State Device Research Conference, 1996. ESSDERC '96. Proceedings of the 26th European
