مرکز منطقه ای اطلاع رساني علوم و فناوري - A Low Cost Bumping Process For Flip Chip-technology Using Electroless Nickel Bumping And Solder Ball Placement

DocumentCode :

3573776

Title :

A Low Cost Bumping Process For Flip Chip-technology Using Electroless Nickel Bumping And Solder Ball Placement

fYear :

1997

Firstpage :

174

Lastpage :

181

Keywords :

Adhesives; Costs; Flip chip; Gold; Nickel; Parallel processing; Sputtering; Substrates; Surface-mount technology; Testing;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]

Print_ISBN :

0-7803-4235-6

Type :

conf

Filename :

619000

Link To Document :