Title :
The robustness of an algorithm applied in wafer-level material property extraction
Author :
Wan-Chun Chuang ; Yu-Ru Lin
Author_Institution :
Dept. of Mech. & Electromech. Eng., Nat. Sun Yat-sen Univ., Kaohsiung, Taiwan
Abstract :
In this study, the robustness of a wafer-level testing algorithm was analyzed and the Taguchi methods were used to perform variability analysis on the effects of differences in test key structural length (ΔL), material crystal direction, and structural length on the Young´s modulus (E) and mean stress (σ0) of thin films. The results of this study indicate that structural length difference is the most crucial prominent factor and substantially affects the convergence of this algorithm. The Taguchi method analysis was then used to determine the suitable scope of application for this algorithm, and determine the optimal test key geometric parameter design that can be used for designing test keys.
Keywords :
Taguchi methods; Young´s modulus; micromechanical devices; Taguchi methods; Young´s modulus; material crystal direction; mean stress; test key structural length; thin films; variability analysis; wafer-level material property extraction; wafer-level testing algorithm; Algorithm design and analysis; Crystals; Material properties; Stress; Young´s modulus; film mechanical properties; mean stress; thin;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2014 Symposium on
Print_ISBN :
978-2-35500-028-7
DOI :
10.1109/DTIP.2014.7056634