Low-noise CMOS amplifier for readout electronic of resistive NEMS audio sensor

Author

Nebhen, J. ; Savary, E. ; Rahajandraibe, W. ; Dufaza, C. ; Meillere, S. ; Kussener, E. ; Barthelemy, H. ; Czarny, J. ; Lhermet, H.

Author_Institution

IM2NP, Aix Marseille Univ., Marseille, France

fYear

2014

Firstpage

1

Lastpage

4

Abstract

Investigation of readout electronic dedicated to electromechanical audio sensor is presented. The circuit is able of reading piezoresistive gauge implemented with silicon nanowire (NEMS) and bring electromechanical signal to high-resolution digital output. Low-noise low-power CMOS operational transconductance amplifier (OTA) is presented. The low-noise amplifier (LNA) has been designed in a 0.28 μm CMOS process with a 2.5 V supply voltage and occupies an area of 120 × 160 μm². For the Post-layout Simulation, the OTA achieves a 65 dB DC gain. It achieves a noise floor of 6 nV/√Hz within the frequency range from 1 Hz to 10 kHz. The total power consumption including the common mode feedback circuit (CMFB) and the biasing circuit is 150 μW.

Keywords

CMOS integrated circuits; audio-frequency amplifiers; low noise amplifiers; nanosensors; nanowires; operational amplifiers; piezoresistive devices; power consumption; readout electronics; silicon; CMFB; DC gain; LNA; OTA; Si; biasing circuit; common mode feedback circuit; electromechanical audio sensor; electromechanical signal; frequency 1 Hz to 10 kHz; gain 65 dB; high-resolution digital output; low noise CMOS amplifier; low-power CMOS operational transconductance amplifier; nanowire; noise floor; piezoresistive gauge; post-layout simulation; power 150 muW; power consumption; readout electronic; resistive NEMS audio sensor; size 0.28 mum; supply voltage; voltage 2.5 V; CMOS integrated circuits; Gain; Microphones; Modulation; Noise; Power demand; Silicon; Audio sensor; LNA; Low-noise; MEMS microphone; OTA;

fLanguage

English

Publisher

ieee

Conference_Titel

Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2014 Symposium on

Print_ISBN

978-2-35500-028-7

Type

conf

DOI

10.1109/DTIP.2014.7056676

Filename

7056676