DocumentCode :
357973
Title :
Mechanistic property and charge storage in amorphous Si3N4 electret film
Author :
Zhang, Xiaoqing ; Zhang, Yewen ; Pan, Yonggang ; Xia, Zhongfu ; Liu, Xianghuai ; Li, Baoqing ; Lin, Zixin
Author_Institution :
Pohl Inst. of Solid State Phys., Tongji Univ., Shanghai, China
Volume :
1
fYear :
2000
fDate :
2000
Firstpage :
525
Abstract :
Amorphous silicon nitride (Si3N4) film has outstanding electret properties and it is compatible to the micromachining technology. Therefore, it is expected to find use as an electret membrane or vibrating membrane in miniature microphones. Both sensitivity and stability are very important parameters in miniature microphones. So high internal stress in Si3N4 film should be eliminated. In this paper, the reduction of internal stress due to boron ion implantation for the LPCVD Si3N4 film on silicon substrate and the influence of boron ion implantation on the mechanics and electret properties of Si3N4 films are discussed. The results show boron ion implantation reduces the internal stress of the Si3N4 film effectively and the charge storage of a Si3N4 film with implanted B ions is worse than for an unimplanted one. The authors conclude that the Si3N4 film is more suitable for use as a vibrating membrane than as a single electret membrane in electret miniature microphones
Keywords :
CVD coatings; Poisson ratio; Young´s modulus; amorphous state; boron; dielectric thin films; electrets; internal stresses; ion implantation; micromechanical devices; silicon compounds; LPCVD; Poisson ratio; Si; Si3N4:B; Young´s modulus; amorphous Si3N4 electrets film; charge storage; electret membrane; internal stress; ion implantation; micromachining; miniature microphones; silicon substrate; vibrating membrane; Amorphous materials; Amorphous silicon; Biomembranes; Boron; Electrets; Internal stresses; Ion implantation; Mechanical factors; Microphones; Semiconductor films;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Properties and Applications of Dielectric Materials, 2000. Proceedings of the 6th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
0-7803-5459-1
Type :
conf
DOI :
10.1109/ICPADM.2000.875745
Filename :
875745
Link To Document :
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