The Optimal Bias Current of Microbolometer under Self-Heating Effect

Author

Chao Chen ; Long Zhang ; Ya Dong Jiang ; Tao Wang

Author_Institution

Key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China

fYear

2014

Firstpage

116

Lastpage

121

Abstract

In this paper, a three-level model of micro bolometer was established by intellisuit software. The total heat capacity, resistance and device thermal conductance Gdev (lower limit) was obtained by theoretical calculation, resistance extraction and dynamic thermal finite element simulation respectively. According to the relationship among of the bias current, effective thermal conductance and device thermal conductance, the range of current is got. Different current and the same amount of heat radiation were loaded on the devices for dynamic thermoelectric coupling finite element simulation. Considering the thermal time constant, effective thermal conductance and power consumption, the optimal current can be drawn.

Keywords

bolometers; computerised instrumentation; finite element analysis; microsensors; specific heat; temperature measurement; temperature sensors; thermal conductivity measurement; thermal resistance measurement; thermoelectricity; dynamic thermal finite element simulation; heat capacity; heat radiation; heat resistance; intellisuit software; microbolometer; optimal bias current; power consumption; self-heating effect; thermal conductance; thermal time constant; thermoelectric coupling finite element simulation; Finite element analysis; Heating; Load modeling; Mathematical model; Resistance; Thermal conductivity; Thermal noise; effective thermal conductance; finite element simulation; microbolometer; the optimal bias current; thermal time constant; thermoelectric coupling; three-level model;

fLanguage

English

Publisher

ieee

Conference_Titel

Computational Intelligence and Communication Networks (CICN), 2014 International Conference on

Print_ISBN

978-1-4799-6928-9

Type

conf

DOI

10.1109/CICN.2014.37

Filename

7065456