DocumentCode :
358524
Title :
Application-based, transistor-level full-chip power analysis for 700 MHz PowerPCTM microprocessor
Author :
Cheng, Yi-Kan ; Bearden, David ; Suryadevara, Kanti
Author_Institution :
Magma Design Autom. Inc., Cupertino, CA, USA
fYear :
2000
fDate :
2000
Firstpage :
215
Lastpage :
220
Abstract :
A chip-level transient power analysis methodology for the 700 MHz PowerPCTM microprocessor has been presented. Transistor-level simulation is used for best accuracy, while input vectors are gathered at the architectural level from certain applications. The IVP is used to describe the sequence of instructions that drive the applications under architecture-specific constraints. The generated cycle-based logic behaviors are then mapped to the timing-based input vectors to regenerate the timing relationship between signals. Algorithms have been presented for simulating the transient power. This methodology can simulate the blocks in a hierarchical manner, while the accuracy is preserved. By fetching the logic values from the AET file, the simulation can start at any user specified cycle to handle RTX state preload and to avoid simulation time waste at the initialization period. Three simulation cases have been studied, including a large custom array, an FPU, and the full chip including IR-drop analysis. This transient power analysis methodology has been successfully employed along the course of PowerPCTM development for the power-aware design of the next-generation microprocessor
Keywords :
circuit simulation; microprocessor chips; timing; 700 MHz; 700 MHz PowerPCTM microprocessor; architecture-specific constraints; cycle-based logic behaviors; power-aware design; timing-based input vectors; transistor-level full-chip power analysis; transistor-level simulation; Algorithm design and analysis; Analytical models; Chip scale packaging; Design automation; Frequency; Logic; Microprocessors; Switches; Timing; Transient analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Design, 2000. Proceedings. 2000 International Conference on
Conference_Location :
Austin, TX
ISSN :
1063-6404
Print_ISBN :
0-7695-0801-4
Type :
conf
DOI :
10.1109/ICCD.2000.878288
Filename :
878288
Link To Document :
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