DocumentCode
3585406
Title
Tiny physical defects inspection by optimized EBI methodology
Author
Hsiang-Chou Liao ; Tuung Luoh ; Ling-Wuu Yang ; Tahone Yang ; Kuang-Chao Chen ; Chih-Yuan Lu ; Donghua Liu ; Rong Lv ; Chingyun Hsiang ; Chenmin Hu
Author_Institution
Technol. Dev. Center, Macronix Int. Co. Ltd., Hsinchu, Taiwan
fYear
2014
Firstpage
1
Lastpage
3
Abstract
An optimization of e beam inspection (EBI) new methodology is implemented to monitor the defective issues in semiconductor manufacturing. The benefits of optimized e beam inspection methodology not only can switch the care area among the inspection tools, but also minimize the inspection shots and the time consumption in EBI application. Inspect tiny physical defects with high throughput using EBI inspection become viable by adopting the new optimized inspection methodology.
Keywords
inspection; semiconductor device manufacture; optimized EBI methodology; optimized e beam inspection methodology; physical defect inspection; semiconductor manufacturing; Inspection; Manufacturing; Optical sensors; Optical switches; Optimization; Sensitivity; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
e-Manufacturing and Design Collaboration Symposium (eMDC), 2014
Type
conf
Filename
7081698
Link To Document