Substrate noise coupling isolation using P+ contact array and grid ground plane in RF/mixed-signal 3D TSV ICs

Author

Jia-Yi Wu ; Mu-Shui Zhang ; Hong-Zhou Tan ; Yong-Xin Guo

Author_Institution

Sch. of Inf. Sci. & Technol., Sun Yat-sen Univ., Guangzhou, China

fYear

2014

Firstpage

183

Lastpage

186

Abstract

In this paper, a substrate noise suppression method using P+ contact array and grid ground plane is proposed, which yield excellent noise suppression below -60 dB in extremely wide frequency range from DC up to 50 GHz. P+ contact array suppresses the low-frequency noise while the grid ground suppresses the high-frequency noise. Accurate circuit models are developed by simple extraction. The noise suppression performance of the proposed structure is compared with guard ring. Results show that our method yields excellent noise suppression performance.

Keywords

integrated circuit modelling; integrated circuit noise; interference suppression; mixed analogue-digital integrated circuits; radiofrequency integrated circuits; three-dimensional integrated circuits; 3D TSV IC; P+ contact array; RF IC; circuit models; frequency 50 GHz; grid ground plane; grid ground suppresses; high-frequency noise; low-frequency noise; mixed-signal IC; noise suppression; radiofrequency integrated circuits; substrate noise coupling isolation; Arrays; Couplings; Integrated circuit modeling; Noise; Substrates; Three-dimensional displays; Through-silicon vias; 3D-IC; Noise coupling suppression; guard ring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging and Systems (EPEPS), 2014 IEEE 23rd Conference on

Print_ISBN

978-1-4799-3641-0

Type

conf

DOI

10.1109/EPEPS.2014.7103629

Filename

7103629