DocumentCode :
3589015
Title :
Minimizing differential crosstalk of vias for high-speed data transmission
Author :
Aihara, Kunia ; Buan, Jeremy ; Nagao, Adam ; Takada, Toshiyuki ; Ching-Chao Huang
Author_Institution :
High-speed Interconnect Dept., Hirose Electr. USA, Inc., Santa Clara, CA, USA
fYear :
2014
Firstpage :
191
Lastpage :
194
Abstract :
This paper presents the design of electrical interconnect for high-speed data transmission involving differential signal vias on printed circuit board (PCB). Between two channels of differential vias, with given intra pair via pitch and spacing from adjacent channel vias, there exists an offset angle where differential crosstalk is minimized. By studying single-ended terms of NEXT and FEXT relation in both time and frequency domain, it becomes clear that such phenomenon occurs once in every quadrant. The crosstalk reduction can be achieved without placing ground vias in between signal vias of two channels, giving more routing space in high-speed PCB designs.
Keywords :
crosstalk; integrated circuit interconnections; printed circuit design; three-dimensional integrated circuits; FEXT; NEXT; adjacent channel vias; crosstalk reduction; differential crosstalk; differential signal vias; electrical interconnect; high-speed PCB design; high-speed data transmission; intrapair via pitch; printed circuit board; single-ended terms; time-frequency domain; Crosstalk; Data communication; Frequency-domain analysis; Microwave technology; Routing; Time-domain analysis; crosstalk reduction; differential via; signal integrity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2014 IEEE 23rd Conference on
Print_ISBN :
978-1-4799-3641-0
Type :
conf
DOI :
10.1109/EPEPS.2014.7103631
Filename :
7103631
Link To Document :
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