DocumentCode
3591077
Title
Innovative practices session 5C: Advancements in test -keeping moore moving!
Author
Amyeen, Enamul
Author_Institution
Intel, USA
fYear
2015
Firstpage
1
Lastpage
1
Abstract
This talk focuses on test and debug challenges that are unique to large die products. A technical review of problems being faced today specific to test quality, test time, test cost, electrical and speed content, and debug will be outlined along with some current solutions being pursued to drive large die products to production quality. The talk concludes with a discussion about new solutions and areas of innovation that will be necessary to keep future generations of these products manufacturable, and on a cadence that meets the stringent time to market requirements.
Keywords
Built-in self-test; Manufacturing; Production; Technological innovation; Time to market; Transistors; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Test Symposium (VTS), 2015 IEEE 33rd
Type
conf
DOI
10.1109/VTS.2015.7116272
Filename
7116272
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