• DocumentCode
    3591077
  • Title

    Innovative practices session 5C: Advancements in test -keeping moore moving!

  • Author

    Amyeen, Enamul

  • Author_Institution
    Intel, USA
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    This talk focuses on test and debug challenges that are unique to large die products. A technical review of problems being faced today specific to test quality, test time, test cost, electrical and speed content, and debug will be outlined along with some current solutions being pursued to drive large die products to production quality. The talk concludes with a discussion about new solutions and areas of innovation that will be necessary to keep future generations of these products manufacturable, and on a cadence that meets the stringent time to market requirements.
  • Keywords
    Built-in self-test; Manufacturing; Production; Technological innovation; Time to market; Transistors; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Test Symposium (VTS), 2015 IEEE 33rd
  • Type

    conf

  • DOI
    10.1109/VTS.2015.7116272
  • Filename
    7116272