Title :
Temperature rise test effect of elevated temperature on 2500 Amps low voltage distribution board
Author :
Viswanatha, C. ; Vittal, G.P. ; Babu, V. Mohan
Author_Institution :
Central Power Res. Inst., Bangalore, India
Abstract :
Performance of distribution board at elevated temperature is vital in the context of reliable operation of electrical network. Guidelines and specifications are available in IEC for distribution board at ambient temperature. This temperature range covers from 23oC to 40oC. The performance at elevated temperature of distribution board is not well known and hence the studies are conducted by subjecting the distributing board to 2500A rating to temperature rise test at elevated temperature of 55oC. The temperatures and the rise values are monitored till thermal equilibrium of distribution board is obtained. The results obtained are analyzed in conjunction with international standards. The studies revealed that thermal performance of distribution board exhibited higher temperature rise values. These studies, results, experimental arrangements are presented in the present research work.
Keywords :
distribution networks; reliability; temperature distribution; temperature measurement; IEC; current 2500 A; electrical network reliable operation; low voltage distribution board; temperature 23 degC to 40 degC; temperature 55 degC; temperature rise test; thermal equilibrium; Copper; IEC; IEC standards; Joints; Low voltage; Temperature distribution; Temperature measurement; LV panel; Thermal performance; busbars; circuit breaker; distribution board; elevated temperature; temperature rise; temporary connections;
Conference_Titel :
Power India International Conference (PIICON), 2014 6th IEEE
Print_ISBN :
978-1-4799-6041-5
DOI :
10.1109/34084POWERI.2014.7117667
