DocumentCode
3592913
Title
A review of computational damage mechanics of mass transport in solder joint
Author
Hamid, Mohd Foad Abdul ; Tamin, Mohd Nasir
Author_Institution
Fac. of Mech. Eng., Univ. Teknol. Malaysia, Skudai, Malaysia
fYear
2014
Firstpage
1
Lastpage
7
Abstract
Motivated by the requirement of International Technology Roadmap for Semiconductors (ITRS), this article addresses ITRS modelling and simulation requirements particularly electromigration and thermomigration. The governing equations, material and damage mechanics models are discussed, finite element formulations are developed, and finally results from simulations and experiments are compared to validate simulation results.
Keywords
electromigration; finite element analysis; solders; ITRS modelling requirement; ITRS simulation requirement; International Technology Roadmap for Semiconductors; computational damage mechanics; damage mechanic model; electromigration; finite element formulation; governing equation; mass transport; material mechanic model; solder joint; thermomigration; Current density; Electromigration; Finite element analysis; Heating; Mathematical model; Soldering; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Conference (IEMT), 2014 IEEE 36th International
Type
conf
DOI
10.1109/IEMT.2014.7123121
Filename
7123121
Link To Document