Title :
High-performance carbon nanotubes thermal interface materials
Author :
Idris, Jamaliah ; Tan Win Hon
Author_Institution :
Fac. of Mech. Eng., Univ. Teknol. Malaysia, Skudai, Malaysia
Abstract :
This paper discusses CNT´s applications in thermal management. High-performance heat dissipation pastes for thermal interface applications were developed by dispersing CNT powder into a silicone oil that widely used in thermal interface material, Thermal conductivities of the resulting samples were measured. The effects of loading wt% of CNT and size and geometric on the thermal conductivity and performance of paste were also investigated. The results showed that the thermal conductivity of the silicone oil enhanced to 1.640 W/mK from pure silicone oil with value 0.165 W/mK. As the loading of CNT increases to 60 wt% the thermal conductivity increase to 4.237 W/mK. The geometric that long cylindrical in shape improve the ability of CNT to enhance the thermal conductivity properties but will cause losing the conformability of paste.
Keywords :
carbon nanotubes; cooling; nanoparticles; oils; silicones; thermal conductivity measurement; thermal management (packaging); C; CNT powder; carbon nanotube thermal interface material; heat dissipation paste; silicone oil; thermal conductivity; thermal management; Conductivity; Contact resistance; Impedance; Loading; Thermal conductivity; Thermal loading; Thermal resistance; Carbon Nanotube (CNT); Thermal Interface Materials (TIM); thermal contact resistance; thermal management;
Conference_Titel :
Electronics Manufacturing Technology Conference (IEMT), 2014 IEEE 36th International
DOI :
10.1109/IEMT.2014.7123135