• DocumentCode
    3594050
  • Title

    Research and development of new generation High Voltage Flip Chip LED

  • Author

    Soon Lee Tan ; Si Teng Zhang ; Tian Cheng Zhang

  • Author_Institution
    Elec-Tech Photoelectric Technol. (Dalian) Co. Ltd., Dalian, China
  • fYear
    2014
  • Firstpage
    53
  • Lastpage
    55
  • Abstract
    This paper presents the development and performance of a new generation of Direct Attach middle power 6V High Voltage Flip Chip (HVFC) LED designed to be directly attached using AuSn or SnAgCu solder by surface mount technology (SMT). Comparison is made against a standard 3V Flip Chip (FC) LED of equal chip dimension (780um × 380um). At 0.5W operation, both HVFC and FC have comparable Wall Plug Efficiency of 37% and Luminous Efficacy of 120lm/W at 6500K CCT, 70 CRI.
  • Keywords
    flip-chip devices; light emitting diodes; solders; surface mount technology; HVFC LED; SMT; high voltage flip chip LED; luminous efficacy; surface mount technology; wall plug efficiency; Electrodes; Flip-chip devices; Gallium nitride; Junctions; Light emitting diodes; Plugs; Standards;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Lighting (SSLCHINA), 2014 11th China International Forum on
  • Print_ISBN
    978-1-4799-6696-7
  • Type

    conf

  • DOI
    10.1109/SSLCHINA.2014.7127220
  • Filename
    7127220
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3594050