• DocumentCode
    3596551
  • Title

    A quick method to realize and characterize bimorph cantilevers

  • Author

    Prajesh, Rahul ; Shankar, Bhawani ; Jain, Nishit ; Agarwal, Ajay

  • Author_Institution
    Central Electron. Eng. Res. Inst., Pilani, India
  • fYear
    2014
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    Bimorph cantilever-based thermal actuators are promising for numerous applications like micro-mirror arrays, etc. This paper presents a simple technique for fabricating bimorph cantilevers using a single photolithography process and a quick optical methodology for the characterization of such structures. A bimorph combination of Al-SiO2 has been realized where SiO2 cantilevers are first realized, followed by aluminum sputtering to make the desired bimorph structure. Silicon oxide cantilevers are defined using optical photolithography, silicon area exposed by etching SiO2 in buffered oxide etch (BOE) solution and structures are released by wet bulk micro-machining of silicon in 25% TMAH solution. The cantilever deflection is characterized in a temperature range of 24-56°C using external heating and the corresponding deflections recorded via 3D imaging. A 97 μm-long cantilever tip shows a deflection of ~3.7 μm, when its temeprature changes by 32°C, corresponding to an actuation of 2.1 degrees.
  • Keywords
    aluminium; cantilevers; microactuators; micromachining; micromirrors; photolithography; silicon; silicon compounds; sputter etching; 3D imaging; Al-SiO2; BOE; TMAH solution; aluminum sputtering; bimorph cantilever; buffered oxide etch; cantilever deflection; external heating; micromirror array; optical methodology; optical photolithography process; silicon; silicon oxide cantilever; temperature 24 C to 56 C; thermal actuator; wet bulk micromachining; Al-SiO2; Cantilever; bimorph; bulk-micromachining; deflection angle;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Emerging Electronics (ICEE), 2014 IEEE 2nd International Conference on
  • Print_ISBN
    978-1-4673-6527-7
  • Type

    conf

  • DOI
    10.1109/ICEmElec.2014.7151129
  • Filename
    7151129