Title :
Trace Orientation Function for Statistical Prediction of PCB Radiated Susceptibility and Emission
Author :
Mehri, Milad ; Masoumi, Nasser ; Rashed-Mohassel, Jalil
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Tehran, Tehran, Iran
Abstract :
In this paper, trace orientation function (TOF) is proposed for statistical prediction of printed circuit board (PCB) radiated susceptibility and emission. This function relates the orientations and angle of incident electromagnetic wave to the location of a trace in wiring distribution of electronic board. For both susceptibility and emission of signal traces, TOF is a compact function that considers the location, orientations, and its probability of distribution. By using the TOF, one can estimate the radiated susceptibility and emission of a PCB for different points of view and derive a safe spatial region to increase the electromagnetic compatibility of electronic systems. In addition, the TOF helps to predict the electromagnetic compatibility of a system before the final step of its PCB implementation. To show the accuracy and effectiveness of TOF concept, the method is applied on a board and the results are compared with CST field solver simulations. The simulation result shows 8.1% error between statistical method and full-wave analysis for maximum electric far field of the board and maximum 42.4% error for average induced voltage on whole traces. Also, an analytic circuit level method is proposed for estimating the current amplitude of modeling dipoles, based on power consumption of the electronic system on PCB.
Keywords :
electric fields; electromagnetic compatibility; electromagnetic waves; printed circuit interconnections; statistical distributions; wiring; CST field solver simulations; PCB radiated susceptibility; TOF; analytic circuit level method; electric far field; electromagnetic compatibility; electronic board; electronic systems; full-wave analysis; incident electromagnetic wave; power consumption; printed circuit board; signal traces; statistical method; statistical prediction; trace orientation function; wiring distribution; Electromagnetic scattering; Estimation; Integrated circuit interconnections; Integrated circuit modeling; Magnetic susceptibility; Power demand; Wiring; Electromagnetic compatibility (EMC); electromagnetic interference (EMI); printed circuit board (PCB) trace distribution; radiated emission; radiated susceptibility;
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
DOI :
10.1109/TEMC.2015.2414353