DocumentCode
3601985
Title
Myths of Equipment Grounding and Bonding
Author
Rappaport, Elliot
Author_Institution
Electro Technol., Coconut Creek, FL, USA
Volume
51
Issue
6
fYear
2015
Firstpage
5212
Lastpage
5217
Abstract
Grounding is thought by many to be synonymous with electrical safety. “If equipment is grounded then it is electrically safe” gives a false sense of security. The process that many consider to be “grounding” can and may minimize the severity of electrical faults when performed with an understanding of what happens during an electrical fault. “Grounding” is very specific; it means a connection to the earth (ground). With respect to systems, such as transformers, generators, or batteries, “grounding” generally means providing a connection from one conductor of the system to an electrode that is buried in the earth. However, not all systems are grounded nor is the electrode always in the earth. When referring to equipment, the term “grounding” can have various meanings. It may mean bonding or it may mean a direct connection to the earth. The term “bonding” sometimes may mean “grounding,” and sometimes, it may mean a short or a long connection. Additionally, equipment “grounding” is often connected with ungrounded systems! This paper only addresses issues related to systems that are intentionally grounded. Several examples are presented to demonstrate the confusion of these two terms and the myths that go with them. Additionally, a discussion is provided concerning the myth that goes with the term “ground fault” and how “grounding” and/or “bonding” is applicable. In conclusion, a proposed definition for the fault return conductor is proposed to emphasize the need for a reliable low impedance path rather than an intentional connection to the earth.
Keywords
earthing; electric shocks; electrical faults; electrical safety; bonding; electric shock; electrical faults; electrical safety; equipment grounding; equipotential; Bonding; Circuit faults; Conductors; Earth; Electric shock; Fault currents; Grounding; Bonding; bonding; electric shock; equipotential; grounding;
fLanguage
English
Journal_Title
Industry Applications, IEEE Transactions on
Publisher
ieee
ISSN
0093-9994
Type
jour
DOI
10.1109/TIA.2015.2425810
Filename
7093138
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