Title :
Mechanical Designs for Inorganic Stretchable Circuits in Soft Electronics
Author :
Shuodao Wang ; Yonggang Huang ; Rogers, John A.
Author_Institution :
Sch. of Mech. & Aerosp. Eng., Oklahoma State Univ., Stillwater, OK, USA
Abstract :
Mechanical concepts and designs in inorganic circuits for different levels of stretchability are reviewed in this paper, through discussions of the underlying mechanics and material theories, fabrication procedures for the constituent microscale/nanoscale devices, and experimental characterization. All of the designs reported here adopt heterogeneous structures of rigid and brittle inorganic materials on soft and elastic elastomeric substrates, with mechanical design layouts that isolate large deformations to the elastomer, thereby avoiding potentially destructive plastic strains in the brittle materials. The overall stiffnesses of the electronics, their stretchability, and curvilinear shapes can be designed to match the mechanical properties of biological tissues. The result is a class of soft stretchable electronic systems that are compatible with traditional high-performance inorganic semiconductor technologies. These systems afford promising options for applications in portable biomedical and health-monitoring devices. Mechanics theories and modeling play a key role in understanding the underlining physics and optimization of these systems.
Keywords :
biological tissues; elastomers; micromechanical devices; nanoelectromechanical devices; biological tissues; brittle inorganic materials; brittle materials; curvilinear shapes; destructive plastic strains; elastic elastomeric substrates; health-monitoring devices; heterogeneous structures; high-performance inorganic semiconductor technologies; inorganic stretchable circuits; mechanical design layouts; mechanical designs; mechanical properties; microscale devices; nanoscale devices; portable biomedical devices; soft elastomeric substrates; soft electronics; soft stretchable electronic systems; Gallium arsenide; Integrated circuit interconnections; Manufacturing; Packaging; Silicon; Strain; Substrates; Biomimicking electronics; buckling; inorganic semiconductor; stretchable electronics; stretchable electronics.;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2015.2417801