DocumentCode
3602186
Title
Low-Cost Fabrication of Hollow Microneedle Arrays Using CNC Machining and UV Lithography
Author
Hoa Le Thanh ; Bao Quoc Ta ; Hai Le The ; Vy Nguyen ; Kaiying Wang ; Karlsen, Frank
Author_Institution
DTU Danchip, Lyngby, Denmark
Volume
24
Issue
5
fYear
2015
Firstpage
1583
Lastpage
1593
Abstract
In order to produce disposable microneedles for blood-collection devices in smart homecare monitoring systems, we have developed a simple low-cost scalable process for mass fabrication of sharp-tipped microneedle arrays. The key feature in this process is a design of computer numerical control-machined aluminum sample (CAS). The inclined sidewalls on the CAS enable microfabricated traditional-shaped microneedles (TMNs) to be produced in the desired shape. This process provides significant advantages over other methods that use inclined lithography or anisotropic wet etching. TMNs with a length of 1510 μm, a hollow diameter of 120 μm, and the tip radius of 16 μm were successfully fabricated. Theoretical study and practical measurements of fracture force verified the improved mechanical strength of TMNs for safe skin insertion. In addition, the penetration tests on cadaver pork skin demonstrated that the TMNs could pierce the pork skin without breaking, and create the transport conduits through microneedle lumens.
Keywords
computerised numerical control; microfabrication; micromechanical devices; ultraviolet lithography; CNC machining; UV lithography; anisotropic wet etching; computer numerical control-machined aluminum sample; hollow microneedle arrays; inclined lithography; inclined sidewalls; low-cost fabrication; microfabricated traditional-shaped microneedles; sharp-tipped microneedle arrays; size 120 mum; size 1510 mum; size 16 mum; Aluminum; Coatings; Computer numerical control; Fabrication; Lithography; Machining; Skin; CNC machining; SU-8 photoresist; UV lithography; fracture force; fracture force.; microneedle arrays;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2015.2424926
Filename
7104095
Link To Document