Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias

Author

Piersanti, Stefano ; De Paulis, Francesco ; Orlandi, Antonio ; Dong-Hyun Kim ; Joungho Kim ; Jun Fan

Author_Institution

Dept. of Ind. & Inf. Eng. & Econ., UAq EMC Lab., L´Aquila, Italy

Volume

57

Issue

6

fYear

2015

Firstpage

1510

Lastpage

1516

Abstract

This paper proposes a numerical solution of the nonlinear equations that describes the hysteretic behavior of the coupling capacitance among through silicon vias in three-dimensional integrated circuits. Behavioral ordinary differential equations are formulated and solved by an equivalent circuit described in SPICE syntax. These results are then compared with those obtained by measurements.

Keywords

dielectric hysteresis; differential equations; equivalent circuits; integrated circuit modelling; nonlinear equations; three-dimensional integrated circuits; 3D integrated circuits; coupling capacitance; dielectric hysteresis loops; equivalent circuit model; nonlinear equations; ordinary differential equations; through silicon vias; Capacitance; Equivalent circuits; Hysteresis; Integrated circuit modeling; Mathematical model; Silicon; Through-silicon vias; Dielectric hysteresis; equivalent circuit; nonlinear circuits; through silicon vias (TSVs); time domain;

fLanguage

English

Journal_Title

Electromagnetic Compatibility, IEEE Transactions on

Publisher

ieee

ISSN

0018-9375

Type

jour

DOI

10.1109/TEMC.2015.2478849

Filename

7297815