DocumentCode
3609712
Title
A Novel Drain Design for ESD Improvement of UHV-LDMOS
Author
Cheng-Hsu Wu ; Jian-Hsing Lee ; Chenhsin Lien
Author_Institution
Inst. of Electron. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Volume
62
Issue
12
fYear
2015
Firstpage
4135
Lastpage
4138
Abstract
This paper investigates the electrostatic discharge (ESD) failure mechanism in the human body model of circular ultrahigh voltage lateral diffused MOS-type devices. Failure occurs due to the current crowding effect at the N+ junction edge of the drain adjacent to the field oxide. Instead of a large single N+ diffusion, a novel drain design with small multidiffusions is proposed to eliminate the current crowding and to enhance its ESD performance.
Keywords
MOSFET; electrostatic discharge; ESD improvement; N+ junction edge; UHV-LDMOS; circular ultrahigh voltage lateral diffused MOS-type devices; current crowding effect; drain design; electrostatic discharge; failure mechanism; human body model; small multidiffusions; Electrostatic discharges; Integrated circuit layout; MOS devices; Resistors; Stress; Circular (C) ultrahigh voltage laterally diffused MOS (C-UHV-LDMOS); UHV; UHV.; electrostatic discharge (ESD); high-voltage n-well (HVNW); reduced-surface field (RESURF);
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2015.2493879
Filename
7317543
Link To Document