DocumentCode :
3619242
Title :
Chip-package co-design of RF mixed signal microsystems
Author :
P.R. Mukund;J. Moon
Volume :
1
fYear :
2003
fDate :
6/25/1905 12:00:00 AM
Firstpage :
211
Lastpage :
258
Keywords :
"Radio frequency","RF signals","Packaging","Signal design","Electrostatic discharge","Circuits and systems","Driver circuits","System-on-a-chip","Power system protection","Power distribution"
Publisher :
ieee
Conference_Titel :
Circuits and Systems, 2003. Tutorial Guide: ISCAS 2003. The IEEE International Symposium on
Print_ISBN :
0-7803-7991-8
Type :
conf
DOI :
10.1109/TUTCAS.2003.1490898
Filename :
1490898
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3619242
